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MCP2036
Inductive Sensor Analog Front End Device
Features:
* Complete Inductance Measurement System: - Low-Impedance Current Driver - Sensor/Reference Coil Multiplexer - High-Frequency Detector * Operating Voltage: 2.7 to 5.5V * Low-Power Standby Mode * Gain and Frequency set by external passive components
Description:
The MCP2036 Inductive Sensor Analog Front End (AFE) combines all the necessary analog functions for a complete inductance measurement system. The device includes: * High-frequency, current-mode coil driver for exciting the sensor coil. * Synchronous detector for converting AC sense voltages into DC levels. * Output amplifier/filter to improve resolution and limit noise. * Virtual ground reference generator for single supply operation. The device is available in 14-pin PDIP, SOIC and 16-pin QFN packages:
Typical Applications:
* * * * Harsh environment inductive keyboards Inductive rotational sensor interface Inductive displacement sensor interface Inductive force sensor interface
Package Types
MCP2036 14-pin PDIP, SOIC VREF 1 LREF 2 LBTN 3 VDD 4 DRVOUT 5 DRVIN 6 CLK 7 MCP2036 16-pin QFN 16 VREF 13 VDET+ 12 VDET11 VDETOUT 10 VSS 9 Reserved REFSEL 7 DRVIN 5 CLK 6 CS 8
15 NC
13 VDET12 VDETOUT 11 VSS 10 Reserved 9 CS 8 REFSEL LREF 1 LBTN 2 VDD 3 DRVOUT 4
(c) 2009 Microchip Technology Inc.
14 NC
14 VDET+
DS22186B-page 1
MCP2036
1.0 FUNCTIONAL DESCRIPTION
The MCP2036 measures a sensor coil's impedance by exciting the coil with a pulsed DC current and measuring the amplitude of the resulting AC voltage waveform. The drive current is generated by the on-chip current amplifier/driver which takes the high-frequency triangular waveform present on the DRVIN input, and amplifies it into the pulsed DC current for exciting the series combination of the sensor coils. LREF LBTN CLK The AC voltages generated across the coils, are then capacitively coupled into the LBTN and LREF inputs. An input resistance of 2K between the inputs and the virtual ground offsets the AC input voltages up to the signal ground generated by the reference voltage generator, as shown in Figure 1-1.
Input MUX REFSEL 1 0 10K
Op. Amp. Block
VDET+
+ VSS Mixer VDETVDD Key Inductor Driver Voltage Reference VREF 10K VDETOUT -
CS
DRVIN
DRVOUT
FIGURE 1-1:
MCP2036 Block Diagram
DS22186B-page 2
(c) 2009 Microchip Technology Inc.
MCP2036
CD4052 0 1 2 3 10 MCP2036 DRVOUT VDETVDETOUT 0 1 2 3 10nF Key Coils LREF LREF REFSEL I/O I/O I/O I/O PIC(R) 10nF LBTN CS VREF DRVIN CLK RIN CIN PWM ADC CADC Microcontroller RADC CFILTER VDET+ RGAIN
CFILTER RGAIN
CRGND
FIGURE 1-2:
MCP2036 Typical Application
The gain of the detector is set by two pairs of resistors; one pair are the internal fixed series resistors between the frequency mixer and the amplifier. The second resistor pair are the two external gain set resistors (RGAIN). The two capacitors (CFILTER) in parallel with the external gain setting resistors form a low pass filter which converts the pulsed DC output signal into a smooth DC voltage which is proportional to the AC sensor voltage input. The output of the system is present on the VDETOUT pin, which drives the microcontroller's ADC input for conversion into a digital value. The virtual ground reference for the detector/amplifier is generated by a second internal op amp which produces a virtual ground equal to 1/2 the supply voltage. The virtual ground is available externally at the VREF output and used internally throughout the detector circuit, allowing single supply operation. A small external capacitance is required to stabilize this output and limit noise.
The coil voltages are then multiplexed into the Synchronous Detector section by the LBTN/LREF multiplexer. This allows the microcontroller to select which signal is sampled by the detector. The detector converts the coil voltages into a DC level using a frequency mixer, amplifier, and filter. The mixer is composed of two switches driven by the clock present on the CLK signal input. The switches toggle the amplifier/filter between an inverting and non-inverting topology, at a rate equal to the clock input frequency. This inverts and amplifies the negative side of the signal, while amplifying the positive side. The result is a pulsed DC signal with a peak voltage, proportional to the amplitude of the AC coil voltage.
(c) 2009 Microchip Technology Inc.
DS22186B-page 3
MCP2036
1.1 Coil Driver 1.2
The coil driver produces the excitation current for the sensor coils. The coil driver input is derived from the digital clock supplied to the CLK input. The digital signal is first filtered through a low-pass filter, composed of RIN and CIN, and passed to the DRVIN input. The driver will create a triangular current in phase and proportional with the input voltage. Because the digital drive into the RIN-CIN filter has a 50% duty cycle, the voltage on the DRVIN input will be centered at VDD/2. The relationship between voltage, current, inductance and frequency is shown in Equation 1-1.
Synchronous Detector and Output Amplifier
The Synchronous Detector has two inputs, LREF and LBTN, selectable by REFSEL. This routes either signal into the frequency mixer of the detector. The frequency mixer then converts the AC waveform into a pulsed DC signal which is amplified and filtered. The gain of the amplifier is user-settable, using an external resistor, RGAIN (see Equation 1-2).
EQUATION 1-2:
Gain R GAIN 10kOhm An ADC plus firmware algorithm then digitizes the detector output voltage and uses the resulting data to detect a key press event. Note: The output amplifier/filter uses a differential connection, so its output is centered to VREF (VDD/2). The amplitude of the detected signal should be calculated as the difference between voltages at the output of the detector and the reference voltage.
EQUATION 1-1:
V OUT = ( I DRV * L COIL * 2 * FDRV ) VOUT = Pulsed Output Voltage I DRV = AC Drive Current Amplitude FDRV = AC Drive Current Frequency L COIL = Inductance of the Sensor Coil
Note: These equations assume a 50% duty cycle.
1.3
Virtual Ground Voltage Reference Circuit
To create both an inverting and non-inverting amplifier topology, a pseudo split supply design is required. To generate the dual supplies required, a rail splitter is included, which generates the virtual ground by creating a voltage output at VDD/2. The output is used by the external passive network of the Detector/Amplifier section as a reference on the non-inverting input. A bypass capacitor of 0.1uF is required to ensure the stability of the output. For reference accuracy, no more than 3mA should be supplied to, or drawn from the reference output pin.
DS22186B-page 4
(c) 2009 Microchip Technology Inc.
MCP2036
2.0 PIN DESCRIPTION
Descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pad Name
PIN FUNCTION TABLE
Pin Number 14 Pins 16 Pins 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 OUT IN IN PWR OUT IN IN IN IN -- PWR OUT IN IN -- -- AN AN AN AN AN AN CMOS CMOS CMOS -- AN AN AN AN -- -- Voltage Reference Reference Inductor Input Active Inductor Input Power Supply Current Driver Output for Inductors Current Driver Input Clock Signal Detector Select Input Chip Select, Active low Must be tied to GND for proper operation. Power Supply Return Detector Output Voltage Negative Input for Output Detector Positive Input for Output Detector No connect No connect I/O Type Description
VREF LREF LBTN VDD DRVOUT DRVIN CLK REFSEL CS Reserved VSS VDETOUT VDETVDET+ NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14
2.1
Chip Select (CS)
2.4
Inductor Inputs (LREF, LBTN)
The circuit is fully enabled when a logic-low is applied to the CS input. The circuit enters in Low-Power mode when a logic-high is applied to this input. During Low-Power mode, the detector output voltage falls to VREF and the supply current is reduced to 0.5 A (typ.). This pin has an internal pull-up resistor to ensure proper selection of the circuit.
These pins are inputs for the external coils (reference and sensor). The inputs should be AC coupled to the coils by a 10nF ceramic capacitor.
2.5
Input Selection (REFSEL)
Digital input that is used to select between coil inputs (reference and sensor).
2.2
Voltage Reference (VREF)
2.6
Clock (CLK)
VREF is a mid-scale reference output. It can source and sink small currents and has low output impedance. A load capacitor between 100nF and 1F needs to be located close to this pin.
The external clock input is used for synchronous detection of the AC waveforms on the coils. The clock signal is also used to generate a triangular waveform applied to coil driver input.
2.3
Power Supply (VDD, VSS)
2.7
Inductor Driver Input (DRVIN)
The VDD pin is the power supply pin for the analog and digital circuitry within the MCP2036. This pin requires an appropriate bypass capacitor of 100nF. The voltage on this pin should be maintained in the 2.7V-5.5V range for specified operation. The VSS pin is the ground pin and the current return path for both analog and digital circuitry of the MCP2036. If an analog ground plane is available, it is recommended that this device be tied to the analog ground plane of the PCB.
The analog input to the coil driver. The triangular waveform applied to this input should be in phase with the clock signal for best performance.
2.8
Inductor Driver Output (DRVOUT)
Driver output used to excite the sensor coils. It is a current-mode output designed to drive small inductive loads.
(c) 2009 Microchip Technology Inc.
DS22186B-page 5
MCP2036
2.9 Detector Output Voltage (VDETOUT) 2.10
The amplifier/filter output from the detector. This is a low-impedance analog output pin (VOUT) for driving the microcontroller ADC. The detector output is rail-to-rail.
Inputs for Output Detector (VDET+, VDET-)
The non-inverting and inverting inputs for the amplifier/filter op amp. The two inputs are connected to the output of the mixer circuit through two internal 10K resistors.
DS22186B-page 6
(c) 2009 Microchip Technology Inc.
MCP2036
3.0 APPLICATIONS
The MCP2036 is an Analog Front End device that uses the electromagnetic interaction between a conductive target and a sensing coil to detect the pressure applied by the user on the surface of a touch panel. The device incorporates all analog blocks for a simple inductor impedance measurement circuit. CD4052 0 1 2 3 10 MCP2036 DRVOUT For an inductive touch system, two methods are used for switching the driver and measurement circuitry between the different sensor coils: analog multiplexers and GPIO grounding (see Figure 3-1 and Figure 3-2). The MCP2036 is designed to work with both configurations:
0 1 2 3
10nF LBTN
Key Coils LREF
LREF 10nF REFSEL I/O I/O I/O PIC(R) Microcontroller
FIGURE 3-1:
Using Analog-Multiplexer for Key Selection (Example)
10 MCP2036 DRVOUT 10nF LBTN LREF Key Coils 10nF REFSEL 4K7 4K7 4K7 4K7 I/O I/O I/O I/O I/O PIC(R) Microcontroller LREF
(c) 2009 Microchip Technology Inc.
DS22186B-page 7
MCP2036
FIGURE 3-2: Using GPIO for Key Selection (Example)
3.1
Application example
Figure 3-3 shows an example for a 4-key Inductive Touch keyboard with key controlled by the IO pins of the PIC(R) MCU. CD4052 0 1 2 3 10 MCP2036 DRVOUT VDETVDETOUT 0 1 2 3 10nF Key Coils LREF LREF REFSEL I/O I/O I/O I/O 10nF LBTN CS VREF DRVIN CLK RIN CIN PWM ADC CADC RADC CFILTER VDET+ RGAIN
CFILTER RGAIN
CRGND
PIC(R) Microcontroller
FIGURE 3-3:
PIC(R)
MCP2036 Typical Application EQUATION 3-2:
V start = VDD 2 -V Vstop = V DD 2 +V
The microcontroller is used to generate a square wave signal and to do all the necessary operations for proper detection of the key press event. Then, RIN-CIN filter converts the square wave output of the PWM into a quasi-triangular waveform. To calculate the amplitude of the triangular signal, the standard charging time equation for an RC network will be used, as shown in Equation 3-1:
EQUATION 3-1:
V ( t ) = V step * [ 1 - exp ( - t RC ) ] For the first half of the square wave, the capacitor CIN is charged through RIN, for the second half, it is discharged through RIN, and assuming that clock signal has a 50% duty cycle factor, we can consider:
DS22186B-page 8
(c) 2009 Microchip Technology Inc.
MCP2036
When the PWM signal switches from low-to-high or from high-to-low, the step voltage applied to the capacitor CIN will be:
EQUATION 3-3:
V step = ( VDD 2 + V ) Substituting in the equation for an RC network:
EQUATION 3-4:
2V = ( V DD 2 + V ) * [ 1 - exp ( - t RC ) ] -t 1 - exp ----------------- R IN C IN VDD V = ---------- * -----------------------------------------2 -t 1 + exp ----------------- RIN C IN
(c) 2009 Microchip Technology Inc.
DS22186B-page 9
MCP2036
The peak-to-peak amplitude of the resulting triangular waveform, at the coil driver input, is shown in Equation 3-5: The total voltage across both the reference and sensor coils would be double (two series inductors). For a specific power supply voltage, half of this power supply, relative to the voltage reference, is available for output amplifier/detector. Assuming a 30% margin, the desired gain for the detector should be about:
EQUATION 3-5:
VPKPK = 2V -t 1 - exp ----------------- RIN C IN VPKPK = VDD * ------------------------------------------t - 1 + exp ----------------- R IN C IN
EQUATION 3-9:
VDD 70% * ---------- 2 Gain = --------------------------------2 * U The gain of the amplifier is user-settable, using an external resistor, RGAIN. The value of that resistor will be determined using the following equation:
Note:
VPKPK should not exceed specified value (600mV) for best performance.
From the previous equation, the designer should choose values for VPKPK and RIN. Using the equation above, the value of CIN will be:
EQUATION 3-10:
Gain R GAIN /10kOhm With a 10-bit ADC, using oversampling and averaging techniques, the effective resolution is close to 11 bits. As shown in AN1239, "Inductive Touch Sensor Design", the typical shift in sensor impedance is typically 3-4%, so the actual number of counts per press is typically between 20 and 40 counts. In this way, the microcontroller firmware could easily detect press event. For a power supply of 5V and U = 10mV, the resulted gain is 81. To obtain this gain, RGAIN = 820kOhm should be used.
EQUATION 3-6:
1 t C IN = ------------------------------------------------------------------ = ------------------------------------------------------------------------------------ VDD - V PKPK V DD - V PKPK RIN * ln --------------------------------------- 2 * F * R IN * ln --------------------------------------- VDD + V PKPK VDD + V PKPK
Note:
Assuming a power supply of 5V and VPKPK=500mV, for RIN=3.9K, CIN should have about 320pF. A 330pF capacitor will be used.
Note:
The amplitude of the pulsed current applied to key inductors will be:
EQUATION 3-7:
I = V PKPK * G DRV G DRV - Gain of Coil Driver This current produces a pulsed voltage to key inductors ends. The amplitude of this voltage will be:
EQUATION 3-8:
I U = L * ----- = L * V PKPK * G DRV * 2F t F - PWM Frequency L - Inductance of Key Inductor
Note:
For a PWM frequency of 2 MHz and inductor value of 2.7H, the amplitude of pulsed voltage will be: U = 10.8mV
DS22186B-page 10
(c) 2009 Microchip Technology Inc.
MCP2036
4.0
4.1
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias.................-40C to +125C Storage temperature .................................. -65C to +150C Voltage on VDD with respect to VSS............. -0.3V to +6.5V Analog Inputs (VDET+, VDET-).............VSS-1.0V to VDD+1.0V Voltage on all other pins with respect to VSS ..................................... -0.3V to (VDD + 0.3V) Current at Output and Supply Pins.............................30 mA Human Body ESD Rating............................................2000 V Machine Model ESD Rating ..........................................200 V Maximum Junction Temperature ............................+150C
4.2
Specifications
DC CHARACTERISTICS
Sym.
VDD IPD IPD IDD IDD
TABLE 4-1:
Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
General Device Parameters Supply Voltage Power-Down Current Quiescent Current
Min.
2.7 -- -- -- -- -- --
Typ.
-- 12 25 2 3.7 3.4 6.8
Max.
5.5 -- -- -- -- -- --
Units
V nA nA mA mA mA mA
Conditions
CS = 1, VDD = +2.7V, (Note 1) CS = 1, VDD = +5.5V, (Note 1) VDD = +2.7V, DRVIN = 0V, CLK = Low VDD = +5.5V DRVIN = 0V, CLK = Low VDD = +2.7V, CLK = 2 MHz VDD = +5.5V CLK = 2 MHz
Active Current
IDD IDD
Digital IO Parameters Digital Input High Voltage Digital Input Low Voltage Input Pins Leakage Current System Parameters DC Open Loop Gain Power Supply Rejection Ratio Common Mode Rejection Ratio Amplifier Input Characteristics Input Offset Voltage Input Bias Current Input Offset Current Input Impedance Amplifier Output Characteristics Minimum Output Voltage Maximum Output Voltage VOMIN VOMAX VSS+20 -- -- -- -- VDD-20 mV mV VOS IB -- IOS ZIN -- -- -- -- -- -- -- -- -- -- -- 1013||6 1013||6 7 20 1 1 -- -- mV pA nA pA ||pF ||pF (Note 1) (Note 1) (Note 1) Common mode impedance Differential impedance AOL PSRR CMMR 90 -- 60 110 86 76 -- -- -- dB dB dB VIH VIL ILKG 0.7VDD -- -- -- -- -- -- 0.3VDD 100 V V nA CS, CLK, REFSEL, LREF, LBTN
Output Amplifier/Filter Specific Parameters
(c) 2009 Microchip Technology Inc.
DS22186B-page 11
MCP2036
TABLE 4-1: DC CHARACTERISTICS (CONTINUED)
Sym.
ISC -- Voltage Reference Specific Parameters Output Voltage Output Short Circuit Current Maximum Output Capacitance Series Output Resistance VREF ISC -- COUT RSER -- -- -- -- -- VDD/2 6 10 -- 250 -- -- -- 1 -- mV mA mA F VDD = 3V VDD = 5V (Note 1) Internal resistor used to stabilize op amp output for pure capacitive loads Electrical Specifications: Unless otherwise indicated, TA = +25C, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Short Circuit Current
Min.
-- --
Typ.
6 10
Max.
-- --
Units
mA mA
Conditions
VDETOUT, VDD = 3V VDETOUT, VDD = 5V
Coil Driver Specific Parameters System Parameters Amplifier Current Gain Power Supply Rejection Ratio Input Characteristics Input Voltage Range Input Bias/Leakage Current Input Impedance Output Characteristics Minimum Output Voltage Maximum Output Voltage Short Circuit Current Resistor Specifications Resistance Value of R1 Resistance Value of R2 R1 R2 -- -- 8 2 -- -- K K Resistor between pass gates and output amplifier input Resistor between LBTN and LREF inputs and voltage reference VOMIN VOMAX ISC ISC VSS+20 -- -- -- -- 6 10 VDD-20 -- -- mV mV mA mA DRVOUT, VDD = 3V DRVOUT, VDD = 5V VMAX IB IB ZIN -- VDD/2 -300 -- -- -- -- -- -- -- 1013||6 1013||6 VDD/2 +300 20 1 -- -- mV pA nA ||pF ||pF VDD = 5V T = 85C (Note 1) T = 125C (Note 1) Common mode impedance Differential impedance AOL AOL PSRR -- -- 60 3 3.6 -- -- -- -- mA/V mA/V dB VDD = +2.7V VDD = +5.5V
TABLE 4-2:
AC CHARACTERISTICS
Sym.
GBWP SR GBWP GBWP SR
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters
Gain Bandwidth Product Slew Rate
Min.
-- -- -- -- --
Typ.
1 0.6 17.8 1 0.6
Max.
-- -- -- -- --
Units
MHz V/s MHz MHz V/s
Conditions
Output Amplifier/Filter Specific Parameters
Coil Driver Amplifier Parameters Gain Bandwidth Product Gain Bandwidth Product Slew Rate Voltage Reference Specific Parameters
DS22186B-page 12
(c) 2009 Microchip Technology Inc.
MCP2036
TABLE 4-3: TEMPERATURE SPECIFICATIONS
Sym.
TA TA TA TA JA JA JA Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters
Temperature Ranges Industrial Temperature Range Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 16L-QFN
Min.
-40 -40 -40 -65 -- -- --
Typ.
-- -- -- -- 70 120 47
Max.
+85 +125 +125 +150 -- -- --
Units
C C C C C/W C/W C/W
Conditions
TABLE 4-4:
TIMING DIAGRAM
Sym.
FCLK D tON tOFF
Electrical Characteristics: Unless otherwise indicated, VDD = +2.7V to +5.5V, and VSS = GND.
Parameters
Input Clock Frequency Duty Factor Device Turn-On Time Device Power-Down Time
Min.
-- -- -- --
Typ.
2 50 4 1--
Max.
-- -- 10 --
Units
MHz % s s
Conditions
Time from CS= 0 to valid VDETOUT output (Note 1) Time from CS= 1 to High-Z outputs on all drivers (Note 1)
Note 1: Not tested in production but it is characterized.
(c) 2009 Microchip Technology Inc.
DS22186B-page 13
MCP2036
NOTES:
DS22186B-page 14
(c) 2009 Microchip Technology Inc.
MCP2036
5.0
5.1
TYPICAL PERFORMANCE CURVES
Performance Plots
FIGURE 5-1:
Driver Input Waveforms
(c) 2009 Microchip Technology Inc.
DS22186B-page 15
MCP2036
FIGURE 5-2:
Inductor Driver Transfer Function (Rload = 100 Ohm)
FIGURE 5-3:
Pulsed Voltage on Active Key Inductor (I/O Configuration)
DS22186B-page 16
(c) 2009 Microchip Technology Inc.
MCP2036
FIGURE 5-4:
Pulsed voltage on Reference Inductor Series with Active Inductor
(c) 2009 Microchip Technology Inc.
DS22186B-page 17
MCP2036
FIGURE 5-5:
Output Detector Response Time
DS22186B-page 18
(c) 2009 Microchip Technology Inc.
MCP2036
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
14-Lead PDIP XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN
Example MCP2036-I/P 0610017
14-Lead SOIC (.150") XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
Example MCP2036 -I/SL 0610017
16-Lead QFN
Example
XXXXXXX XXXXXXX YYWWNNN
MCP2036 -I/MG 0610017
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2009 Microchip Technology Inc.
DS22186B-page 19
MCP2036
6.2 Package Details
The following sections give the technical details of the packages.
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DS22186B-page 20
(c) 2009 Microchip Technology Inc.
MCP2036
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(c) 2009 Microchip Technology Inc.
DS22186B-page 21
MCP2036
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DS22186B-page 22
(c) 2009 Microchip Technology Inc.
MCP2036
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
(c) 2009 Microchip Technology Inc.
DS22186B-page 23
MCP2036
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS22186B-page 24
(c) 2009 Microchip Technology Inc.
MCP2036
APPENDIX A: REVISION HISTORY
Revision A (05/2009)
Original release of the document.
Revision B (09/2009)
Replaced the 4X4 QFN Package with the 3X3 QFN Package; Replaced ML with MG in the 16-Lead QFN Example; Added SOIC (SL) Land Pattern.
(c) 2009 Microchip Technology Inc.
DS22186B-page 25
MCP2036
NOTES:
DS22186B-page 26
(c) 2009 Microchip Technology Inc.
MCP2036
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package XXX Pattern Examples:
MCP2036 - I/P 301 = Industrial temp., PDIP package, QTP pattern #301.
Device:
MCP2036 VDD range 2.7V to 5.5V I E MG SL P = -40C to +85C = -40C to +125C = = = QFN SOIC PDIP (Industrial) (Extended)
Temperature Range:
Package:
Pattern:
QTP, SQTP, Code or Special Requirements (blank otherwise)
(c) 2009 Microchip Technology Inc.
DS22186B-page 27
MCP2036
NOTES:
DS22186B-page 28
(c) 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2009 Microchip Technology Inc.
DS22186B-page 29
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
DS22186B-page 30
(c) 2009 Microchip Technology Inc.

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